Key Steps
HieFo's InP fab enables us to provide specialty chips for next-generation telecom, data center, optical sensing applications.
DEVICE DESIGN
EPITAXIAL CROWTH
WAFER PROCESSING
COB SUB-ASSEMBLY
InP Wafer Fab Introductions
HieFo owns and operates a world-class InP semiconductor wafer fabrication plant at our corporate headquarters. The state-of-the-art facility supports the development and manufacturing of best-in-class Telecom wireless, Data Center and optical sensing market. Our vertically integrated fab features MOCVD reactors for wafer processing of InP-based devices including lasers, APDs, and PIN photodetectors. The plant also includes advanced equipment such as steppers, wafer tracks, ICP, RIE, diffusion, metal and dielectric deposition, and cleaving/dicing. Our highly experienced technical team has deep expertise in device design, epitaxial growth, wafer processing, device characterization and COB sub-assembly to deliver high-performance products from development through manufacturing. HieFo's InP fab enables us to provide specialty chips for next-generation telecom, data center, optical sensing applications.
