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HieFo Introduces High Power DFB Laser Chip for Coherent Optical Transmission

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Press Release

HieFo Introduces High Power DFB Laser Chip for Coherent Optical Transmission

2024

09-10

HieFo Introduces High Power DFB Laser Chip for Coherent Optical Transmission

ALHAMBRA, Calif., Sept. 09, 2024 (GLOBE NEWSWIRE) -- HieFo’s latest product release addresses the demanding requirements of Coherent Optical transmission by...

2024

09-04

Hiefo Introduces Next Generation High Power Gain Chip for Integrated Tunable Laser Assembly (xITLA)

ALHAMBRA, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- The latest Highest Efficiency Gain Chip design addresses critical market demands for higher optical output power and lower electrical power consumption. HieFo’s HGC20 C+band Gain Chip sets a new...

2024

08-26

HieFo's Indium Phosphide Fab in Alhambra, California Resumes Production

HieFo Corporation, a US-based manufacturer of photonic devices for the optical communications and sensing industries, is pleased to announce the resumption of...

HIEFO IS FOCUSING ON ADVANCED

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In the News

2024.09.02

HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations

HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations Forward from Emcore’s press release on May 2. 2024

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