Datacom


In the rapidly evolving world of data, HieFo's solutions are at the forefront of innovation. Our deep understanding of the challenges posed by high-speed, low-latency interconnects within and between data centers has paved the way for groundbreaking photonic technologies. From co-packaged optics (CPO) and silicon photonics transceivers to the seamless integration of our Coherent-Lite solutions, we deliver unmatched performance and efficiency. Explore our design expertise, where high-performance, low-power consumption photonic components are precisely crafted to meet the demanding requirements of data center environments.

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Standard Gain Chip HGC16

For External Cavity Based Narrow Linewidth Tunable Laser, High Bitrate Telecom and DCI Datacom applications

O-Band HCL30

For Next Generation Coherent High-Speed Connectivity Datacom and AI applications

C-Band HCL30

For Next Generation Coherent High-Speed Connectivity, Datacom and AI applications

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Datacom

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