HieFo Acquires EMCORE's Chips Business and Wafer Fabrication Operations
Time:
Sep 02, 2024
HieFo Corporation, a Delaware-based company co-founded by Dr. Genzao Zhang and Harry Moore, has completed the acquisition of substantially all assets related to EMCORE's non-core discontinued Chips business line and InP wafer fabrication operations. The transaction, which was consummated on April 30, 2024, included the transfer of equipment, contracts, intellectual property, and inventory from EMCORE's facility in Alhambra, California.
As part of the agreement, HieFo will initially sublease one full building and a portion of another building at the Alhambra site, ultimately leasing two full buildings and being liable for a pro rata portion of the rent starting July 1, 2024.
HieFo has successfully engaged nearly all key scientists, engineers, and operation personnel from EMCORE's discontinued Chips business and will continue operations at the current Alhambra campus.
Dr. Genzao Zhang, CEO of HieFo and former EMCORE VP of Engineering, stated, "By leveraging more than four decades of innovative legacy in optoelectronic devices from EMCORE, we will continue the pursuit of the most innovative and disruptive solutions to serve telecom, datacom, and AI connectivity industries. With the experienced core team and strong financial backing, we will be resuming the operations very rapidly."
HieFo Corporation will focus on the development and commercialization of high-efficiency photonic devices for optical communication industries.
For inquiries, please contact info@hiefo.com.
This news is forwarded from an EMCORE press release.
RELATED PRODUCT
