OFC 2025: HieFo Showcases Next-Gen Optical Solutions
Time:
Apr 01, 2025
Alhambra, California – March 24, 2025 - HieFo, a leading global optical chip technology company, is set to unveil multiple new innovative products at the Optical Fiber Communication Conference (OFC) in San Francisco from March 30 to April 3, 2025.
High-Power Narrow Linewidth DFB Lasers: Redefining Integrated Optical Platforms
HieFo is announcing the release of a full suite of InP-based DFB laser products that combine high-efficiency optical output with narrow-linewidth performance, meeting the stringent requirements of coherent optical transmission. HieFo now offers multiple product configurations, including bare chip, chip-on-carrier (COC), and packaged lasers in an industry-standard 14-pin butterfly module. Typical optical output power options are available up to 150mw, with a spectral linewidth variation as narrow as 50kHz. Both O-band and C-band options are now available. HieFo’s lasers offer exceptional performance suitable for multiple applications in data centers, AI connectivity, telecommunications, and sensing.
High-Power Gain Chip: Enhancing Efficiency by 40%
HieFo's next-generation high-power gain chip product offering, designed for integrated tunable laser components (xITLA), effectively addresses the market's urgent need for higher optical output power and lower power consumption compared to existing gain chips. HieFo’s gain chip family currently supports optical output power approaching 22dBm, depending on the drive current. For applications requiring lower overall module power consumption, HieFo’s efficient design can increase the wall-plug efficiency (WPE) by up to 40% compared to conventional gain chips. Gain chip products are available in standard off-the-shelf chip-on-carrier configurations or can be customized depending on customer requirements.
High-Power CW Laser Chip for Uncooled Applications up to 75°C (Recently Released)
HieFo's latest innovation addresses intensity-modulated direct-detect applications, typically integrated with silicon photonics-based transceivers to meet the ever-increasing data center market demands. HieFo’s new CW laser supports optical output options at both 70mw and 100mw initially, with higher-power designs currently in development. HieFo supports the CWDM4 wavelength range from 1271nm to 1331nm. Product evaluation samples are available, while Telcordia qualification is in process.
HieFo’s DFB Laser Chip: Enabling Next-generation Wireless Infrastructure
HieFo unveiled a new wireless DFB laser chip with an industry-leading RF modulation bandwidth over 15 GHz, exceptional linearity, and ultra-low RIN. Engineered for high-performance analog signal transmission, these lasers are available across key telecom wavelengths from O-band through the C-band, supporting a wide range of RF-over-fiber deployment scenarios. The chip’s combination of bandwidth, efficiency, and low noise makes it ideal for distributed antenna systems (DAS), wireless backhaul for 5G and 6G, satellite communications, remote radio heads, fiber-fed small cells, and other advanced analog photonic applications.
Unveiling Disruptive Technology for Future Network Architectures: Driving Innovation with 12 Filed IP Applications
HieFo senior management will be available for private meetings to discuss these innovations at OFC. With a strong commitment to intellectual property development, HieFo has filed 12 IP applications, further solidifying its position as a leader in photonics. Please contact HieFo directly at info@hiefo.com to arrange a meeting and discuss details of this technology during the conference. Discover more about HieFo at www.hiefo.com.
About HieFo
HieFo Corporation is headquartered at 2015 Chestnut St in Alhambra, California 91803. Through a management buyout, HieFo leverages more than four decades of innovative legacy in optoelectronic devices. HieFo now focuses on development and commercialization of high-efficiency photonic devices for optical communication industries and will continue the pursuit of the most innovative and disruptive solutions to serve datacom, telecom, AI connectivity and general sensing industries.
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